POP/SIP Application
Product features:
- 8 in-line multi-heads bonding at a high speed and with high accuracy
- Applicable to various types of components
- Applicable to a wide area of 460mm-long and 330mm-wide
- Capable of bonding at any angle
- Usable for flux transfer
Model | PoP/SIP Application |
Head Specifications | 8in-line multi heads,Applicable bonding angle:0 degree to 360 degree L460 x W330mm |
Bonding available area | 3σ<30μm |
Printing accuracy | CHIP components □1 to □10mm |
Applicable components specification | SMT components 0402 to □31mm CHIP components:Max 60 types |
Number supplying components types | SMT components:Max 48 types(converted in 8mm tape) |